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hanhuark/BoilingBench-Multimodal

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Citation text from the card

Cite the relevant dataset-specific publication(s), the source archival DOI where provided, and the exact BoilingBench release/profile. The following references identify the current provenance:

- BoilingBench-1: Prince, Hossain, Pierson, and Hu, “Coupled Thermal and Acoustic Signatures of Slow Modulation in Microbubble Emission Boiling,” manuscript in preparation.
- BoilingBench-2: Hossain, Prince, Pierson, Dunlap, Parjuli, and Hu, “Pressure-Adjusted Post-CHF Apparent Base-Wall Superheat Correlates with Boiling Hysteresis in Subatmospheric Pool Boiling,” manuscript in preparation.
- BoilingBench-3/-4: Pandey, Li, Dunlap, and Hu, “Unveiling Hysteresis of Transient Boiling: A Multimodal Perspective,” *Applied Thermal Engineering*, 262, 125259 (2025); Dryad DOI [10.5061/dryad.ksn02v7h2](https://doi.org/10.5061/dryad.ksn02v7h2).
- BoilingBench-5: Dunlap et al., “BubbleID: A Deep Learning Framework for Bubble Interface Dynamics Analysis,” *Journal of Applied Physics*, 136, 014902 (2024); and Fahim et al., “BubbleID-Flow,” manuscript in preparation.
- BoilingBench-6: Dunlap, Pandey, Weems, and Hu, “Nonintrusive Heat Flux Quantification Using Acoustic Emissions During Pool Boiling,” *Applied Thermal Engineering*, 228, 120558 (2023); Dryad DOI [10.5061/dryad.q573n5tvq](https://doi.org/10.5061/dryad.q573n5tvq).
- BoilingBench-7: Pandey et al., “Two-Phase Immersion Cooler for Medium-Voltage Silicon Carbide MOSFETs,” 2024 IEEE ITherm Conference; Dryad DOI [10.5061/dryad.k98sf7mk9](https

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dataset_licence({ "id": "hanhuark/BoilingBench-Multimodal" })
signal: "permissive"
stated_licence: "cc-by-4.0"
sources: 0